HILLSBORO, Ore. — Leave it to Intel Corp. to redefine the way 300-mm wafer technology is brought into production. Today, the world's largest chip maker told the press that it is applying a new ...
System-Level Design sat down to discuss challenges to 3D-IC adoption with Samta Bansal, product marketing for applied silicon realization in strategy and market development at Cadence; Carey Robertson ...
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