The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

Rebecca Oesterle saw the packaging industry growth first hand as one of Energizer’s earliest supply chain managers. Over her career, she led many changes in packaging—an industry that would become ...

The MarketWatch News Department was not involved in the creation of this content. Enosemi Inc. ("Enosemi") and Jabil Inc. (NYSE: JBL) today announced a collaboration in advanced packaging process ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

Novel hybrid polymer “PET/F” expected to deliver enhanced performance compared with traditional PET plastic and have up to 100% bio content WEST SACRAMENTO, Calif. & BOLTON, Ontario--(BUSINESS ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

"Aero Packaging procures die-cutting machine for corrugated cartons" was originally created and published by Packaging ...

Penn College Workforce Development staff members recently assisted industry leaders — including two Penn College alumni — at ...

Advances in materials, tooling, and technology continue to blur the line between the most suitable process and a given application. Thermoforming, of course, can be used to make everything from ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

TNO at Holst Centre works with a range of thin-film technologies, originally developed for display and electronics applications, that have very interesting potential in other, fast-growing application ...